ENZOTECH MST-73 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-73 heatsink is made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MST-73 heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
- Dimensions (mm): 79.5(L) x 14(W) x 29.6(H)
- Material: C1100 Forged Copper
- Weight: 62g
- Thermal Adhesive: Fujipoly GR-d Thermal Tape
- SUPPORTED MB:
ASUS P6T
ASUS P6T6 WS Revolution
ASUS P6T WS Professional
ASUS P6T Deluxe
ASUS P6T Deluxe/OC Palm